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Molex launches BiPass™ I/O and Backplane Cable Assemblies at DesignCon 2017

Molex will debut its new BiPass™ I/O and Backplane Cable Assemblies in Molex booth 619 at the DesignCon 2017 Expo, to be held February 1-2 at the Santa Clara Convention Center in Santa Clara, CA. Combining QSFP+, ImpelTM or near-ASIC connectors with thin twinax cables, the BiPass I/O and Backplane Assemblies provide a low-insertion-loss alternative to PCB traces capable of meeting 112 Gbps PAM-4 (pulse-amplitutde modulation) protocol.

To meet today's demanding industry needs, datacenter and other customers designing TOR switches, routers, and servers need I/O and backplane connections capable of high bandwidth speeds and efficiency, while ensuring proper thermal management in densely packed circuits and not sacrificing signal integrity. BiPass Assemblies provide terminated I/O ports that connect via twinax cables to high density, high performance near-ASIC connectors in order to maintain the highest level of signal integrity from ASICs to the I/O. BiPass Assemblies also use near-ASIC connectors with low stack height for a smaller footprint within trays and panels to overcome space constraints.

"BiPass Assemblies offer our customers a complete solution to enable 56 Gbps and 112 Gbps PAM-4 implementation by dramatically reducing signal to noise ratios from the ASIC to I/O," said Brent Hatfield, new product development manager, Molex. "The integrated, one-piece design using board-mount connectors also ensures easy installation at the CM."

BiPass I/O and Backplane Cable Assemblies are ideal for applications in several markets, including data communications and telecom and networking. Assemblies are thoroughly tested, eliminating the need for customers to conduct their own tests, and they can be easily customized to individual front panel configurations, according to the needs of specific applications.

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